Product encapsulation

As a natural complement to our services, we offer electronics encapsulation—a critical process for protecting circuits against the harmful effects of external factors.

What is encapsulation and why should You consider it?

Encapsulation is the process of protecting sensitive electronic components (primarily Printed Circuit Boards) using specialized protective materials. It is not a standard assembly step, but an advanced engineering technique we employ to ensure long-term, failure-free operation.

Threats Mitigated by Encapsulation

Every operating environment poses unique challenges to electronics. Encapsulation is the ultimate solution to the most destructive external factors:

Moisture and Corrosion: Any liquid, from ambient humidity to accidental immersion, can lead to short circuits and irreversible corrosion of traces and components.
Dust and Contaminants: Fine particulates can settle on components, leading to overheating or insulation failures.
Vibrations and Mechanical Shocks: In mobile, industrial, or transportation products, vibrations can cause solder joint fatigue or physical damage. Encapsulation reinforces the entire assembly, providing structural rigidity.
Extreme Temperatures: Specialized protection assists in thermal management and shields against cyclic temperature changes that lead to „material fatigue.”

Tailored encapsulation for Your product

We don’t believe in universal solutions. Our encapsulation process is tailored individually, taking into account the target operating environment, budget, and specific product requirements. Our most frequently used methods include:

Conformal Coating: Application of a thin, flexible layer of specialized lacquer, primarily protecting against moisture and dust. This is the ideal choice when minimal change in weight and dimensions is required.
Potting & Encapsulation: Completely immersing and sealing the PCB in specialized resin. This provides maximum mechanical, thermal, and environmental protection, creating a nearly indestructible barrier.

Through in-depth project analysis at an early stage, we select materials (acrylics, silicones, epoxies, and polyurethanes) with optimal properties: flexibility, thermal conductivity, and chemical resistance.

Automation, Precision, and Quality – Advanced Encapsulation